Featured Stories

EDA Tool Reduces Chip Test Time With Same Die Size

Cadence combines physically-aware scan logic with elastic decompression in new test solution. What does that really mean? By John Blyler, Editorial Director Cadence recently announced the Modus Test Solution suite that the company claims will enable up to 3X reduction in test time and up to 2.6X reduction in compression logic wirelength. This improvement is made possible, in part, by …

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The UVM Factory Object and Encapsulation or For God’s Sake Don’t Touch that Code!

The often-misunderstood UVM factory object provides a path to modify testcase behavior without the associated doom of touching already released code. by Hamilton Carter, Senior Editor All of us have seen some variation of the following flow chart:   The basic message, “If you can get away without touching it, you might just be OK,” applies as well to design verification …

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